Interests and Statement

Interdisciplinary metrologist with nearly 3 years of materials characterization and critical dimension analysis using FEI dual beams and 2 years of electrodynamic modeling/hardware implementation and project management. Dedicated to process improvement and creating novel techniques to provide all forms of metrology quickly and efficiently while ensuring only the best quality.

Current Position: Lead Etch Metrology Process Engineer II

Lam Research | Electron Micorsocopy Lab | Tualatin OR

Utilized FEI/Thermo dual beams to process and image lamella using 30kv STEM

Created novel techniques to process thin lamella, each with dedicated BKM and training modules. Each BKM optimized for single lift out and no needle rotations.

Live-STEM: Upright thin lamella ~40nm thickness in under 15 minutes

Single-Side Inversion: Ultra-thin inverted lamella for STEM ~20nm in 20min

Double-Side Inversion: Hyper-thin inverted lamella for TEM ~ 5nm in 30min

Lead Etch Metrology team of almost 10 techs using FEI 400 to Thermofisher Helios 5

Techs submit images and I accept or deny them based on AOI, image quality and other issues with lamella prep before submitting to customers 

Created AI/Machine learning to examine images before approval

Tool maintenance/upkeep and personnel assignments 

Optimize team assignments for difficulty (transistors, fins, dielectric, nano-structures)

Presented weekly meetings to team regarding new processes, BKMs and safety

Failure analysis reports/documentation in STEM (BF/DF), FIB-SEM, EDX and AFM

Inverted/upright/horizontal BKMs for High Aspect Ratio (HAR) and Planar

Automated tools to provide lamella in AutoTem

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